Bumpless Build-up Layer
Bumpless Build-up Layer (BBUL) is a processor packaging technology developed by Intel. It is bumpless, because it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires.
Bumpless Build-up Layer (BBUL) is a processor packaging technology developed by Intel. It is bumpless, because it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires.
Bumpless Build-up Layer (BBUL) is a processor packaging technology developed by Intel. It is bumpless, because it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires.
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