Burn-in ovens in electronics device fabrication, are designed for dynamic and static burn-in of integrated circuits and other electronic devices, including laser diodes. Typical sizes are from under ten to over 30 cubic feet (0.85 m3), with air or nitrogen configurations.
Burn-in ovens in electronics device fabrication, are designed for dynamic and static burn-in of integrated circuits and other electronic devices, including laser diodes. Typical sizes are from under ten to over 30 cubic feet (0.85 m3), with air or nitrogen configurations.
Source: Wikipedia "Burn-in oven" · CC BY-SA 4.0
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