Fan-out wafer-level packaging

Fan-out wafer-level packaging (also known as wafer-level fan-out packaging, fan-out WLP, FOWL packaging, FO-WLP, FOWLP, etc.) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions. Fan-out packaging is seen as a low cost advanced packaging alternative to packages that use silicon interposers, such as those seen in 2.5D and 3D packages.