Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes "nodule" structures that extend out horizontally from the edges of microchips to make chip-to-chip interconnections. QP nodules are created as an integral part of a microchip using standard back end of the line techniques in semiconductor device fabrication.
Quilt Packaging (QP) is an integrated circuit packaging and chip-to-chip interconnect packaging technology that utilizes "nodule" structures that extend out horizontally from the edges of microchips to make chip-to-chip interconnections. QP nodules are created as an integral part of a microchip using standard back end of the line techniques in semiconductor device fabrication.
Source: Wikipedia "Quilt packaging" · CC BY-SA 4.0
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