A system in a package, or system in package (SiP), is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using die stacking or package on package, placed side by side (multi-chip module, MCM), and/or embedded in the substrate.
A system in a package, or system in package (SiP), is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive components and perform the functions of an entire system. The ICs may be stacked using die stacking or package on package, placed side by side (multi-chip module, MCM), and/or embedded in the substrate.
Source: Wikipedia "System in a package" · CC BY-SA 4.0
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