Thermal design power

Thermal design power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (CPU, GPU, or system on chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency). Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating.

Source: Wikipedia — Thermal design power (CC BY-SA 4.0)

Thermal design power

Thermal design power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (CPU, GPU, or system on chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency). Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP rating.

Source: Wikipedia "Thermal design power" · CC BY-SA 4.0

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