Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (ICs). ICs are produced on semiconductor wafers that undergo a multitude of processing steps.
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (ICs). ICs are produced on semiconductor wafers that undergo a multitude of processing steps.
Source: Wikipedia "Wafer backgrinding" · CC BY-SA 4.0
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