Zig-zag in-line package
The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP).
The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP).
The zig-zag in-line package (ZIP) is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging (DIL or DIP).
Source: Wikipedia "Zig-zag in-line package" · CC BY-SA 4.0
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