Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a bare silicon die and the lead frame of the package it is placed in during semiconductor device fabrication. Gold or copper wire can be used, though gold is more common because its oxide is not as problematic in making a weld.
Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a bare silicon die and the lead frame of the package it is placed in during semiconductor device fabrication. Gold or copper wire can be used, though gold is more common because its oxide is not as problematic in making a weld.
Source: Wikipedia "Ball bonding" · CC BY-SA 4.0
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